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2651.

Springer handbook of electronic and photonic materials edited by S. Kasap and P. Capper. Kasap,S.

Call Number	R621.381 K15S
Author	Kasap,S.
Title	Springer handbook of electronic and photonic materials edited by S. Kasap and P. Capper. Handbook of electronic and photonic materials
Publication	New York : Springer, 2006.
Physical Description	xxxii, 1406 p. : col. ill. ; 25 cm.

1 copy is available at

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2652.

Multifield problems in solid and fluid mechanics edited by Rainer Helmig, Alexander Mielke and Barbara I. Wohlmuth. Helmig,Rainer.

Call Number	532 H36M
Author	Helmig,Rainer.
Title	Multifield problems in solid and fluid mechanics edited by Rainer Helmig, Alexander Mielke and Barbara I. Wohlmuth.
Publication	Berlin : Springer-Verlag, c2006.
Physical Description	xi, 571 p. : ill. ; 24 cm.
Series	Lecture notes in applied and computational mechanics, 1613-7736 ; v. 28

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2653.

Scalable optimization via probabilistic modeling : from algorithms to applications / Martin Pelikan, Kumara Sastry, Erick Cantu-Paz (eds.). Pelikan, Martin

Call Number	519.2 P36S
Author	Pelikan, Martin
Title	Scalable optimization via probabilistic modeling : from algorithms to applications / Martin Pelikan, Kumara Sastry, Erick Cantu-Paz (eds.).
Publication	Berlin ; New York : Springer, c2006.
Physical Description	xx, 349 p. : ill. ; 24 cm.
Series	Studies in computational intelligence, 1860-949x ; v. 33

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2654.

Rare earth doped semiconductors II : symposium held April 8-10, 1996/ edited by Salvatore Coffa, Albert Polman and Robert N. Schwartz. Coffa,Salvatore

Call Number	537.622 C65R
Author	Coffa,Salvatore
Title	Rare earth doped semiconductors II : symposium held April 8-10, 1996/ edited by Salvatore Coffa, Albert Polman and Robert N. Schwartz. Rare earth doped semiconductors 2 Rare earth doped semiconductors two
Publication	Pittsburgh : Materials Research Society, 1996.
Physical Description	xiii, 366 p. : ill. ; 24 cm.
Series	Materials Research Society symposium proceedings ; v. 422

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2655.

Bonding in microsystem technology / J.A. Dziuban. Dziuban, J. A.

Call Number	621.3811 D99B
Author	Dziuban, J. A.
Title	Bonding in microsystem technology / J.A. Dziuban.
Publication	[London] : Springer, c2006.
Physical Description	xviii, 331 p. : ill. ; 25 cm.
Series	Springer series in advanced microelectronics ; 24

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2656.

An invitation to 3-D vision from images to geometric models edited by Yi Ma and Others.

Call Number	001.6443 In7-
Title	An invitation to 3-D vision from images to geometric models edited by Yi Ma and Others.
Publication	New York : Springer, 2004.
Series	Texts in applied mathematics

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2657.

Simulation-based lean six-sigma and design for six sigma : transactional process engineering by Basem El-Haik and Raid Al-Aomar. El-Haik, Basem.

Call Number	658.562 El39S
Author	El-Haik, Basem.
Title	Simulation-based lean six-sigma and design for six sigma : transactional process engineering by Basem El-Haik and Raid Al-Aomar.
Publication	Hoboken : John Wiley, 2006.
Physical Description	404p.
Multimedia	Publisher description http://www.loc.gov/catdir/enhancements/fy0645/2006048112-d.html

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2658.

Applied crystallography Proceedings of the XIX Conference edited byHenryk Morawiec and Danuta Stroz. Morawiec, Henry K.

Call Number	548 M79A
Author	Morawiec, Henry K.
Title	Applied crystallography Proceedings of the XIX Conference edited byHenryk Morawiec and Danuta Stroz.
Publication	Singapore : World Scientific, 2004.
Physical Description	424 p.

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2659.

Continued fractions Doug Hensley. Hensley, Doug

Call Number	516.2 H39C
Author	Hensley, Doug
Title	Continued fractions Doug Hensley.
Publication	Hackensack, N.J. : World Scientific, 2006.
Physical Description	xiii, 245 p. : ill. ; 24 cm.
Multimedia	Table of contents only http://www.loc.gov/catdir/toc/fy0708/2006281718.html

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2660.

Probability and risk analysis : an introduction for engineers by Igor Rychlik and Jesper Ryden. Rychlik, Igor.

Call Number	519.2 R96P
Author	Rychlik, Igor.
Title	Probability and risk analysis : an introduction for engineers by Igor Rychlik and Jesper Ryden.
Publication	Berlin : Springer, 2006.
Physical Description	x, 281 p. : ill. ; 24 cm.
Multimedia	Table of contents only http://www.loc.gov/catdir/toc/fy0708/2006925439.html

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