Dielectric films for advanced microelectronics edited by Mikhail Baklanov, Martin Green, and Karen Maex.

Baklanov,M
Call Number
621.381 B17D
Author
Baklanov,M
Title
Dielectric films for advanced microelectronics edited by Mikhail Baklanov, Martin Green, and Karen Maex.
Publication
Chichester, England ; Hoboken, NJ : John Wiley & Sons, c2007.
Physical Description
xxii, 486 p. : ill. ; 26 cm.
Series
Wiley series in materials for electronic and optoelectronic applications
Contents
Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / Spin-on dielectric materials / Positron annihilation spectroscopy / Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / Ellipsometric porosimetry / Mechanical and transport properties of low-k dielectrics / Integration of low-k dielectric films in damascene processes / ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / Material engineering of high-k gate dielectrics / Physical characterization of ultra-thin high-k dielectric / Electrical characterization of advanced gate dielectrics / Integration issues of high-k gate dielectrics / Anisotropic conductive film (ACF) for advanced microelectronic interconnects /
Added Author
Baklanov, Mikhail.
Green, Martin.
Maex, Karen.
Subject
DIELECTRIC FILMS.
Microelectronics Materials.
Multimedia
Total Ratings: 0
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$a Dielectric films for advanced microelectronics $c edited by Mikhail Baklanov, Martin Green, and Karen Maex.
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$a Chichester, England ; $a Hoboken, NJ : $b John Wiley & Sons, $c c2007.
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$a xxii, 486 p. : $b ill. ; $c 26 cm.
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$a Wiley series in materials for electronic and optoelectronic applications
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$a Includes bibliographical references and index.
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$t Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / $r A. Grill -- $t Spin-on dielectric materials / $r Geraud Dubois, Robert D. Miller, Willi Volksen -- $t Positron annihilation spectroscopy / $r David W. Gidley, Hua-Gen Peng, Richard Vallery -- $t Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / $r Christopher L. Soles ... [et al.] -- $t Ellipsometric porosimetry / $r Mikhail R. Baklanov -- $t Mechanical and transport properties of low-k dielectrics / $r J. L. Plawsky ... [et al.] -- $t Integration of low-k dielectric films in damascene processes / $r R. J. O. M. Hoofman ... [et al.] -- $t ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / $r Yakov Roizin, Vladimir Gritsenko -- $t Material engineering of high-k gate dielectrics / $r Akira Toriumi, Koji Kita -- $t Physical characterization of ultra-thin high-k dielectric / $r T. Conard, H. Bender, W. Vandervorst -- $t Electrical characterization of advanced gate dielectrics / $r Robin Degraeve ... [et al.] -- $t Integration issues of high-k gate dielectrics / $r Yasuo Nara -- $t Anisotropic conductive film (ACF) for advanced microelectronic interconnects / $r Yi Li, C. P. Wong.
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$a DIELECTRIC FILMS.
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$a Microelectronics $x Materials.
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$a Baklanov, Mikhail.
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$a Green, Martin.
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$a Maex, Karen.
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Contents
Low and ultralow dielectric constant films prepared by plasma-enhanced chemical vapor deposition / Spin-on dielectric materials / Positron annihilation spectroscopy / Structure characterization of nanoporous interlevel dielectric thin films with x-ray and neutron radiation / Ellipsometric porosimetry / Mechanical and transport properties of low-k dielectrics / Integration of low-k dielectric films in damascene processes / ONO structures and oxynitrides in modern microelectronics : material science, characterization and application / Material engineering of high-k gate dielectrics / Physical characterization of ultra-thin high-k dielectric / Electrical characterization of advanced gate dielectrics / Integration issues of high-k gate dielectrics / Anisotropic conductive film (ACF) for advanced microelectronic interconnects /
Subject
DIELECTRIC FILMS.
Microelectronics Materials.
Multimedia