Magnetic, electrical and surface morphological characterization of AuGe/Ni/Au Ohmic contact metallization on GaAs/AlGaAs multilayer structures

dc.contributor.author	Abhilash, T. S.
dc.contributor.author	Ravi Kumar, Ch
dc.contributor.author	Rajaram, G.
dc.date.accessioned	2022-03-27T06:41:54Z
dc.date.available	2022-03-27T06:41:54Z
dc.date.issued	2011-12-01
dc.description.abstract	A process issue arising from the use of ferromagnetic Nickel in the AuGe/Ni/Au Ohmic contact metallization is studied in the context of magnetic field sensors and HEMT devices made using GaAs/AlGaAs multilayer structures with the two dimensional electron gas layer. The dependence of magnetization, contact resistance, adhesion, surface roughness and current distribution of alloyed Ohmic contacts on parameters such as Ni layer thickness, anneal temperature and Au-Ge alloy composition are discussed. The magnetization measurements provided some new and interesting insights into changes occurring in the metallization layers prior to alloying. © 2011 SumDU.
dc.identifier.citation	Journal of Nano- and Electronic Physics. v.3(1 PART2)
dc.identifier.issn	20776772
dc.identifier.uri	https://dspace.uohyd.ac.in/handle/1/9772
dc.subject	GaAs/AlGaAs
dc.subject	Hall sensors
dc.subject	Magnetic properties
dc.subject	Ohmic contact
dc.title	Magnetic, electrical and surface morphological characterization of AuGe/Ni/Au Ohmic contact metallization on GaAs/AlGaAs multilayer structures
dc.type	Journal. Article
dspace.entity.type

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